Press Release: Bio-based Conductive Adhesive Enables Clean Disassembly Without Compromising Bond Strength
● Proof-of-concept debondable, bio-based conductive adhesive developed through the Horizon Europe-funded REFORM project, designed as a drop-in replacement for petroleum-based microelectronic adhesives
● Delivers industry-competitive bond strength, with on-demand debonding triggered by an external stimulus, enabling clean component recovery without damage to the component or substrate
● Bisphenol-free, formulated from bio-based feedstocks, and compatible with standard 1K syringe dispensing equipment, no new infrastructure required
The REFORM project, a Horizon Europe-funded research and innovation consortium, has developed a proof-of-concept debondable, bio-based conductive adhesive for microelectronics assembly, with development led by CPI.
The demonstrator shows the potential for an adhesive that bonds with industry-competitive strength, conducts electricity, and releases cleanly on demand, working within existing assembly processes as a drop-in replacement for conventional petroleum-based adhesives.
The challenge for manufacturers
Conventional microelectronic adhesives are designed to bond permanently, which creates significant challenges for end-of-life disassembly, component recovery, and recycling. As electronics manufacturers come under increasing pressure to support repairability and circular economy principles, the inability to cleanly separate bonded assemblies without damaging components or substrates is a practical barrier. Most conventional adhesives are also petroleum-based and may contain bisphenol compounds, presenting sustainability concerns that are increasingly subject to regulatory scrutiny.
What the demonstrator shows
The proof-of-concept adhesive is formulated from bio-based feedstocks and is bisphenol-free. It is dispensed using standard 1K syringe equipment already in use on existing electronics assembly lines, requiring no new infrastructure. Once cured, the adhesive delivers industry-competitive bond strength, validated on standard test substrates.
The demonstrator also shows the adhesive's debond-on-demand capability. When an external trigger is applied, the bond releases cleanly, the component is recovered undamaged and ready for reuse or recycling, and the substrate remains intact. The adhesive forms a reliable electrical joint and is available in both anisotropic and isotropic conductive variants to suit different assembly requirements.
Glenn Lamming, Senior Research Scientist at CPI, which led development of the adhesive, said:
"Permanent bonding has been a fundamental constraint on electronics repairability and end-of-life recovery for a long time. Developing an adhesive that maintains the bond strength manufacturers need, while making controlled disassembly possible, is a meaningful step towards more circular electronics assembly”.
“The bio-based formulation adds a further sustainability dimension that we expect will become increasingly relevant as regulatory requirements tighten. We're pleased to have led this work as part of the REFORM consortium."
Proof-of-concept demonstrator
A proof-of-concept demonstrator has been produced showing the adhesive dispensed using standard syringe equipment, cured to industry-competitive bond strength, and debonded on demand with clean component recovery. The demonstrator also covers electrical conductivity testing across the bonded joint and LED circuit operation, illustrating the adhesive's suitability for electrically conductive assembly applications.
About the REFORM project
REFORM (grant agreement No. 101070255) is a four-year Horizon Europe research and innovation project developing green materials and components for the printed electronics sector. The project is coordinated by CIDETEC and brings together a consortium of eleven European partners. Further information is available at reform-project.eu.
